Principle of plasma technology for small vacuum plasma processing equipment to solve product bonding problems
Principle of plasma technology for small vacuum plasma processing equipment to solve product bonding problems

Principle of plasma technology for small vacuum plasma processing equipment to solve product bonding problems

Category:

Environmental Protection/Cleaning and cleaning equipment/Cleaning machine

Model:

CRF-VPO-4L-S

Brand:

CRF/Chengfeng Intelligent Manufacturing

Retail Price

45,000.00USD


重量

kg

  • Product Description
  • Description :

      Small vacuum plasma processing machines are used in the printed circuit board industry, semiconductor IC field, silicone, plastic, polymer field, automotive electronics industry, aviation industry, etc.

      Printed circuit board industry: high-frequency board surface activation, multi-layer board surface cleaning and de drilling, soft board and soft hard bonding board surface cleaning and de drilling, activation before soft board reinforcement. Semiconductor IC field: COB, COG, COF, ACF processes, used for cleaning before wire bonding and soldering; Plasma surface roughening, etching, and activation of silicone, plastics, and polymers in the field of silicone, plastics, and polymers.

    AfterSalesService :

    Key words:
    • Vacuum plasma processing machine