Low temperature plasma technology for surface modification of ultrafine AP powder using vacuum plasma cleaning machine
Category:
Environmental Protection/Cleaning and cleaning equipment/Cleaning machine
Model:
CRF-VPO-8L-S
Brand:
CRF/Chengfeng Intelligent Manufacturing
Retail Price
126,000.00USD
重量
kg
- Product Description
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Description :
Vacuum plasma cleaning equipment is used in the printed circuit board industry, semiconductor IC field, plasma silicone processing, plastic processing, polymer field, automotive electronics industry, aviation industry, etc.
In the printed circuit board industry, high-frequency board surface activation, multi-layer board surface cleaning, de drilling, soft board, soft hard bonding board surface cleaning, de drilling, and activation before soft board reinforcement.
In the field of semiconductor ICs, COB, COG, COF, ACF processes are used for cleaning before wire bonding and soldering; Silicone, plastic, and polymer fields: Surface roughening, plasma etching, and activation of silicone, plastic, and polymer. Surface activation modification technology.
AfterSalesService :
Key words:- Plasma cleaning machine
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