Linear wide width plasma cleaning equipment improves surface active surface adhesion through plasma cleaning

Description :

　　The fully automatic plasma cleaning equipment can be applied to FPC& Surface treatment for PCB, composite materials, glass, ITO and other industries;

　　The patented built-in cooling system improves and ensures the service life and performance of the equipment;

　　Flexible On Line installation method, the energy of electrons and ions can reach over 10 eV, and the efficiency of material batch processing can be more than 10 times higher than that of low-pressure glow discharge devices.

　　Application of fully automatic plasma cleaning equipment:

　　The removal of adhesive residue from double-layer soft boards with high thickness to diameter ratios and the removal of adhesive residue from hard soft fusion boards improves the bonding compressive strength between the hole edge and the copper plating layer, removes adhesive residue to enhance reliability, and avoids open circuits caused by copper plating on the inner layer.

　　The surface modification activity of the high-frequency copper sinking PTFE plate's front hole wall improves the adhesion between the hole wall and the copper plating layer, avoiding black holes and bursting holes. Solder mask and activation of the character front plate effectively prevent solder mask characters from falling off.

AfterSalesService :

• Plasma cleaning equipment