Wide width plasma cleaning machine price plasma technology principle surface activation modification cleaning treatment
Wide width plasma cleaning machine price plasma technology principle surface activation modification cleaning treatment

Wide width plasma cleaning machine price plasma technology principle surface activation modification cleaning treatment

Category:

Environmental Protection/Cleaning and cleaning equipment/Cleaning machine

Model:

CRF-APO- 500W-XN

Brand:

CRF/Chengfeng Intelligent Manufacturing

Retail Price

122,000.00USD


重量

kg

  • Product Description
  • Description :

      Wide width plasma cleaning machine applied to FPC& Surface treatment for PCB, composite materials, glass, ITO and other industries;

      The patented built-in cooling system improves and ensures the service life and performance of the equipment;

      Flexible On Line installation method, the energy of electrons and ions can reach over 10 eV. Fully automatic surface treatment application equipment, non-standard customization, on-site installation!

      Application of wide width plasma cleaning machine equipment:

      The through-hole and blind/buried hole of the laser on the HDI board eliminate the carbon compound burned by the laser. The actual effect of microplates with a diameter less than 50 μ m is more significant, regardless of the specifications for pore size.

      The plasma cleaning machine removes the residual film of dry film during the detailed production line.

      The passivation treatment of the PI surface layer before the compression of the hard soft board composite type, and the roughening treatment of the PI surface layer before the reinforcement of the flexible circuit board can increase the tensile strength value by more than ten times.

      Clean and eliminate solder mask ink and other residues on the surface of fingers and pads before chemical immersion/electroplating process to improve adhesion. Due to its reliability, some large soft sheet metal processing plants have replaced traditional grinding machines with plasma fully automatic equipment.

      After chemical immersion/electroplating, the removal of the surface layer of the solder pad before SMT improves solderability, avoids the low rate of virtual soldering and soldering before SMT, and improves strength.

    AfterSalesService :

    Key words:
    • Plasma cleaning machine