Plasma cleaning machine wide equipment for semiconductor silicon wafer surface treatment to improve surface hydrophilicity

Description :

　　Wide width plasma cleaning machine applied to FPC& Surface treatment for PCB, composite materials, glass, ITO and other industries;

　　The patented built-in cooling system improves and ensures the service life and performance of the equipment;

　　Flexible On Line installation method, the energy of electrons and ions can reach over 10 eV. Fully automatic low-temperature wide width plasma cleaning machine equipment, customized non-standard, on-site installation!

　　The function of wide plasma cleaning machine equipment:

　　Cleaning of the surface layer before BGA packaging of PCB board, pre-treatment of gold wire, and production and processing of EMC pre packaging to improve the strength of wire routing/connection.

　　The LCD industry module board is cleaned of air oxidation and contamination such as glue leakage during the lamination process of the gold finger protective film. The surface of the polarizer is cleaned before bonding.

　　IC semiconductor material industry semiconductor material polishing wafer, for the removal of oxide films and organic compounds; The cleaning of external pollutants such as COB/COG/COF/ACF during the processing technology improves adhesion and reliability.

AfterSalesService :

• Plasma cleaning machine