Low temperature plasma technology solves the problem of plastic packaging transfer printing. Wide width plasma cleaning machine

Description :

　　Application of wide plasma cleaning machine in FPC& Surface treatment for PCB, composite materials, glass, ITO and other industries;

　　The patented built-in cooling system improves and ensures the service life and performance of the equipment;

　　Flexible On Line installation method, the energy of electrons and ions can reach over 10 eV, and the efficiency of material batch processing can be more than 10 times higher than that of low-pressure glow discharge devices.

　　Specific application of wide plasma cleaning machine technology:

　　The removal of adhesive residue from double-layer soft boards with high thickness to diameter ratios and the removal of adhesive residue from hard soft fusion boards improves the bonding compressive strength between the hole edge and the copper plating layer, removes adhesive residue to enhance reliability, and avoids open circuits caused by copper plating on the inner layer.

　　The surface modification activity of the high-frequency copper sinking PTFE plate's front hole wall improves the adhesion between the hole wall and the copper plating layer, avoiding black holes and bursting holes. Solder mask and activation of the character front plate effectively prevent solder mask characters from falling off.

　　The through-hole and blind/buried hole of the laser on the HDI board eliminate the carbon compound burned by the laser. The actual effect of microplates with a diameter less than 50 μ m is more significant, regardless of the specifications for pore size.

　　The plasma cleaning machine removes the residual film of dry film during the detailed production line.

AfterSalesService :

• Plasma cleaning machine