Electroplating, bonding, welding, pre bonding plasma treatment, removal of microscopic substances, vacuum plasma cleaning machine
Electroplating, bonding, welding, pre bonding plasma treatment, removal of microscopic substances, vacuum plasma cleaning machine

Electroplating, bonding, welding, pre bonding plasma treatment, removal of microscopic substances, vacuum plasma cleaning machine

Category:

Environmental Protection/Cleaning and cleaning equipment/Cleaning machine

Model:

CRF-VPO-8L-S

Brand:

CRF/Chengfeng Intelligent Manufacturing

Retail Price

126,000.00USD


重量

kg

  • Product Description
  • Description :

      The vacuum plasma cleaning machine has a large processing space and improves processing capacity. It adopts a PLC+touch screen control system to control the operation of the equipment;

      We can customize the device cavity capacity and number of layers according to customer requirements to meet their needs; Low maintenance and repair costs, facilitating customer cost control;

      High precision, fast response, good handling and compatibility, complete functions and technical support.

      The vacuum plasma cleaning machine is suitable for the printed circuit board industry, semiconductor IC field, silicone, plastic, polymer field, automotive electronics industry, aviation industry, etc.

      Printed circuit board industry: high-frequency board surface activation, multi-layer board surface cleaning and de drilling, plasma surface cleaning and de drilling of soft boards and soft hard bonding boards, activation before soft board reinforcement.

      Semiconductor IC field: COB, COG, COF, ACF processes, used for cleaning before wire bonding and soldering; Surface roughening, etching, and activation of silicone, plastics, and polymers in the field of silicone, plastics, and polymers.

    AfterSalesService :

    Key words:
    • Vacuum plasma cleaning machine