Plasma surface treatment machine, linear wide width plasma cleaning machine, fully automatic, high efficiency

Description :

　　Fully automatic On Line AP plasma processing system

　　Product Features

　　The fully automatic plasma cleaning machine is applied to FPC& Surface treatment for PCB, composite materials, glass, ITO and other industries;

　　The patented built-in cooling system improves and ensures the service life and performance of the equipment;

　　Flexible On Line installation method, the energy of electrons and ions can reach over 10 eV, and the efficiency of material batch processing can be more than 10 times higher than that of low-pressure glow discharge devices.

　　Fully automatic plasma processing system plasma cleaning machine manufacturer plasma cleaning technology specific application:

　　1. The removal of adhesive residue from double-layer soft boards with high thickness to diameter ratios and the removal of adhesive residue from hard soft fusion boards improves the bonding compressive strength between the hole edge and the copper plating layer, removes adhesive residue to enhance reliability, and avoids open circuits caused by copper plating on the inner layer.

　　2. The surface modification activity of the high-frequency copper sinking PTFE plate's front hole wall improves the adhesion between the hole wall and the copper plating layer, avoiding black holes and bursting holes. Solder mask and activation of the character front plate effectively prevent solder mask characters from falling off.

　　3. The through-hole and blind/buried hole of the laser on the HDI board eliminate the carbon compound burned by the laser. The actual effect of microplates with a diameter less than 50 μ m is more significant, regardless of the specifications for pore size.

　　4. The plasma cleaning machine removes the residual film of dry film during the detailed production line.

　　5. The passivation treatment of the PI surface layer before the compression of the hard soft board composite type, and the roughening treatment of the PI surface layer before the reinforcement of the flexible circuit board can increase the tensile strength value by more than ten times.

　　6. Clean and eliminate solder mask ink and other residues on the surface of fingers and pads before chemical immersion/electroplating process to improve adhesion. Due to its reliability, some large soft sheet metal processing plants have replaced traditional grinding machines with plasma fully automatic equipment.

　　7. After chemical immersion/electroplating, the removal of the surface layer of the solder pad before SMT improves solderability, avoids the low rate of virtual soldering and soldering before SMT, and improves strength.

　　8. Cleaning of the surface layer before BGA packaging of PCB board, pre-treatment of gold wire, and production and processing of EMC pre packaging to improve the strength of wire routing/connection.

　　9. The LCD industry module board is cleaned of air oxidation and contamination such as glue leakage during the lamination process of the gold finger protective film. The surface of the polarizer is cleaned before bonding.

　　10. IC semiconductor material industry semiconductor material polishing wafer, for the removal of oxide films and organic compounds; The cleaning of external pollutants such as COB/COG/COF/ACF during the processing technology improves adhesion and reliability.

　　11. Clean the soldering surface before wire bonding in the LED industry to remove organic compounds.

　　12. Like PTFE, plastic, glass, and polypropylene also have no mechanical properties, so this material requires plasma treatment before printing and dispensing. Glass and surface also have mild metal material contamination, which can be treated with plasma cleaning machines, silicone functional key connectors, and polymer surface modification to improve printing and coating adhesion.

AfterSalesService :

• Plasma surface treatment machine