Small vacuum plasma cleaning machine supports customized application chip surface to enhance adhesion
Small vacuum plasma cleaning machine supports customized application chip surface to enhance adhesion

Small vacuum plasma cleaning machine supports customized application chip surface to enhance adhesion

Category:

Environmental Protection/Cleaning and cleaning equipment/Cleaning machine

Model:

CRF-VPO-2L-S

Brand:

CRF/Chengfeng Intelligent Manufacturing

model:

CRF-VPO-2L-S

mode of movement:

wheeled

Processing & Customization:

yes

Drive Type:

power supply

purpose:

Surface plasma cleaning before packaging electronic products

weight:

eighty-two

Place of Origin:

Shenzhen, Guangdong

manufacturer:

Shenzhen Chengfeng Intelligent Manufacturing Co., Ltd

Retail Price

128,880.00USD


重量

kg

  • Product Description
  • model

    CRF-VPO-2L-S

    mode of movement

    wheeled

    Processing & Customization

    yes

    Drive Type

    power supply

    purpose

    Surface plasma cleaning before packaging electronic products

    weight

    eighty-two

    Place of Origin

    Shenzhen, Guangdong

    manufacturer

    Shenzhen Chengfeng Intelligent Manufacturing Co., Ltd

    Description :

      Product features of small vacuum plasma cleaning machine:

      1. Large processing space, increased processing capacity, using PLC+touch screen control system to control equipment operation;

      2. We can customize the device cavity capacity and number of layers according to customer requirements to meet their needs;

      3. Low maintenance and repair costs, facilitating customer cost control; High precision, fast response, good handling and compatibility, complete functions and technical support.

      Application scope: The vacuum plasma cleaning machine is suitable for the printed circuit board industry, semiconductor IC field, silicone, plastic, polymer field, automotive electronics industry, aviation industry, etc. Printed circuit board industry: high-frequency board surface activation, multi-layer board surface cleaning, de drilling and dirt removal, soft board, soft hard bonding board surface cleaning, de drilling and dirt removal, activation before soft board reinforcement. Semiconductor IC field: COB, COG, COF, ACF processes, used for cleaning before wire bonding and soldering; Surface roughening, etching, and activation of silicone, plastics, and polymers in the field of silicone, plastics, and polymers.

    AfterSalesService :

    Key words:
    • Small vacuum plasma cleaning machine