Vacuum plasma cleaning machine, safe and residue free plasma treatment before coating baby bottles
Category:
Environmental Protection/Cleaning and cleaning equipment/Cleaning machine
Model:
CRF-VPO-8L-S
Brand:
CRF/Chengfeng Intelligent Manufacturing
model:
CRF-VPO-8L-S
mode of movement:
wheeled
Processing & Customization:
yes
Drive Type:
vacuum pump
purpose:
Product surface plasma cleaning treatment enhances material surface performance and improves adhesion
weight:
two hundred and fifty
Place of Origin:
Shenzhen, Guangdong
manufacturer:
Shenzhen Chengfeng Intelligent Manufacturing Co., Ltd
Retail Price
170,000.00USD
重量
kg
- Product Description
-
model CRF-VPO-8L-S
mode of movement wheeled
Processing & Customization yes
Drive Type vacuum pump
purpose Product surface plasma cleaning treatment enhances material surface performance and improves adhesion
weight two hundred and fifty
Place of Origin Shenzhen, Guangdong
manufacturer Shenzhen Chengfeng Intelligent Manufacturing Co., Ltd
Description :
Shenzhen Chengfeng Intelligent Manufacturing Co., Ltd. is an enterprise dedicated to providing plasma equipment and process solutions, using plasma surface treatment technology to solve product surface treatment problems for customers.
Product characteristics of vacuum plasma cleaning machine
● Large processing space, increased processing capacity, using PLC+touch screen control system to control equipment operation;
Customization of equipment cavity capacity and number of layers according to customer requirements to meet their needs; Low maintenance and repair costs, facilitating customer cost control;
High precision, fast response, good handling and compatibility, complete functions and technical support.
The application scope of vacuum plasma cleaning machine is used in the printed circuit board industry, semiconductor IC field, silicone, plastic, polymer field, automotive electronics industry, aviation industry, etc. Printed circuit board industry: high-frequency board surface activation, multi-layer board surface cleaning and de drilling, plasma surface cleaning and de drilling of soft boards and soft hard bonding boards, activation before soft board reinforcement. Semiconductor IC field: COB, COG, COF, ACF processes, used for cleaning before wire bonding and soldering; Surface roughening, etching, and activation of silicone, plastics, and polymers in the field of silicone, plastics, and polymers.
AfterSalesService :
Key words:- Vacuum plasma cleaning machine
More Products
