Microwave absorbing and heat-conducting pad, electromagnetic shielding and heat dissipation silicone sheet, specialized for high-frequency circuit modules

Description :

  Microwave absorbing thermal pad is a dual effect composite material that combines electromagnetic wave absorption and heat conduction functions. It mainly solves the complex working condition problem of electromagnetic interference (EMI) and device overheating coexisting in high-frequency electronic devices. In 5G communication base stations, radar modules, and high-performance computing chipsets, this material can effectively absorb reflected microwaves in specific frequency bands, reduce signal crosstalk, and quickly transfer the Joule heat generated by the chip to the heat sink or metal casing. This dual mechanism ensures the signal integrity and thermal stability of electronic systems in compact spaces, and is a key interface material in modern high-frequency and high-density assembly processes.

  The microwave absorbing and heat-conducting gasket is usually composed of a polymer silicone rubber matrix, magnetic absorbing particles, and high thermal conductivity fillers. Common thickness specifications range from 0.5mm to 3.0mm, and can be customized and cut according to installation gaps. Its thermal conductivity is usually between 1.0W/m · K and 6.0W/m · K, depending on the filler ratio and process pressing density. The surface of the material has natural micro adhesiveness, making it easy to adhere to irregular surfaces. Follow the UL94 V-0 flame retardant rating as a reference for implementing standards to ensure that combustion does not spread in high-temperature working environments. Some high-end models have passed RoHS and REACH environmental certifications to meet the compliance requirements of export-oriented electronic products. The dielectric constant and magnetic permeability are precisely controlled to match specific frequency bands.

  When selecting microwave absorbing thermal pads, it is important to consider the operating frequency range and heat dissipation requirements. If the application scenario is mainly in the microwave frequency band of 2GHz-18GHz, a formula with strong magnetic loss should be selected; If the focus is on heat dissipation of power devices, priority should be given to the thermal conductivity index. Compared with ordinary pure thermal conductive silicon film, this product has added absorption function, but the cost is slightly higher; Compared with pure wave absorbing foam, it has better thermal conductivity and higher mechanical strength, and is suitable for assembly environments with pressure requirements. Not suitable for lightweight shell filling that is extremely sensitive to weight and has no heat dissipation requirements, and it is not recommended to use it in long-term high temperature environments exceeding 150 ℃ to avoid performance degradation caused by substrate aging.

  Before installing the microwave absorbing thermal pad, the contact surface must be cleaned to remove oil, dust, and oxide layers to ensure optimal thermal contact and absorption effect. After removing the protective film, attach the gasket flat between the heat source and the heat dissipation structure to avoid the formation of bubbles or wrinkles, otherwise it may form thermal resistance or electromagnetic leakage points. The typical usage cycle is consistent with the lifespan of the equipment, but in severe vibration or extreme temperature environments, it is recommended to regularly check whether the gasket has displacement or powdering. In daily maintenance, if the signal noise level of the equipment increases or the temperature is abnormal, the gasket should be checked for permanent deformation caused by compression and replaced with a new product of the same specification in a timely manner to restore system performance.

AfterSalesService :